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TPS819
TOSHIBA Photo IC Silicon Epitaxial Planar
TPS819
Mobile Phones, PHS, Pagers Notebook PCs, PDAs Cameras Other Equipment Requiring Luminosity Adjustment
The TPS819 is a linear-output photo-IC which incorporates a photodiode and a current amp circuit in a single chip. This photo-IC also incorporates a luminous-efficiency correction filter, so output value is close to luminosity characteristics. * * * * High sensitivity : IL = 50~100 A @EV = 100 lx p = 522 nm LED Luminous efficiency correction filter mounted on detector : p = 550 nm (typ.) Open-emitter output Compact and light surface-mount package Unit: mm
Maximum Ratings (Ta = 25C)
Characteristics Supply voltage Output voltage Light current Permissible power dissipation Operating temperature range Storage temperature range Soldering temperature range (Note 1) Symbol VCC VOUT IL P Topr Tstg Tsol Rating -0.5~7 < VCC = 10 70 -25~85 -40~100 260 Unit V V mA mW C C C
TOSHIBA Weight: 0.017 g (typ.)
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions.
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TPS819
Recommended Operating Conditions
Characteristics Supply voltage Lead resistance Symbol VCC RL Min 2.2 510 Typ. 3/4 3/4 Max 5.5 3/4 Unit V W
Electrical and Optical Characteristics (Ta = 25C)
Characteristics Supply current Light current (1) Light current (2) Light current (3) Symbol ICC IL (1) IL (2) IL (3) Test Condition VCC = 3 V, EV = 1000 lx, RL = 1 kW (Note 2) VCC = 3 V, EV = 10 lx (Note 2, 5) VCC = 3 V, EV = 100 lx (Note 2, 5) VCC = 3 V, lp = 522 nm, EV = 100 lx (Note 3, 5) Min 3/4 3/4 3/4 50 Typ. 2 20 200 3/4 Max 3/4 3/4 3/4 100 mA Unit mA
IL (IR)
Light current ratio
IL (3)
(Note 4, 5) ILEAK Vo lp tr VCC = 3.3 V, EV = 0 VCC = 3 V, RL = 75 kW, EV = 100 lx (Note 3) 3/4
3/4 3/4 2.2 3/4 3/4 VCC = 3 V, RL = 5 kW, lp = 522 nm (Note 6) 3/4 3/4 3/4
0.03
0.10
Dark current Saturation output voltage Peak sensitivity wavelength
3/4 2.35 550 0.2 1 0.3 0.02
0.5 3/4 3/4 3/4 3/4 3/4 3/4
mA V nm
Switching time
tf td ts
ms
Note 2: CIE standard A light source is used (color temperature = 2856K) Note 3: Green LED (lp = 522 nm) is used as light source and set an illuminance meter for 100 lx. Light current classification: A Rank: 50~83.5 mA, B Rank: 60~100 mA Note 4: Infrared LED (lp = 870 nm) is used as light source for IL (IR) and light current is set to obtain VCC = 3 V and 2 E = 0.01 mW/cm . Note 5: Light current measurement circuit
IF LED TPS819 A VCC IL OUT
Note 6: Rise time/fall time measurement method
Pulse drive lp = 522 nm LED VCC
IF td 1.5 V ts 90%
TPS819 RL
OUT VOUT 10% GND tr tf
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TPS819
Package Dimensions
Weight: 0.017 g (typ.)
Pin Connection
3 VCC Current amp 4 OUT 1 GND 2 GND
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TPS819
Handling Precautions
* At power-on in darkness the internal circuit takes about 50 ms to stabilize. During this period the output signal is unstable and may change. Please take this into account.
Moisture-proof Packing
(1) (2) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored after opening the moisture proof bag under the following conditions: Temperature: 5C~30C, Humidity: 60% (max), Storage time: 168 h (max) Please perform baking when the storage time is expired. Expiration date for an unopened moisture proof bag is six month and 168 h for an opened moisture proof bag. This device is a tape packed product; hence, do not bake the product at high temperature: Recommended baking condition: Baking Temperature = 60C, Baking Hours = 12 h or longer
(3)
Mounting Precautions
(1) (2) (3) Do not apply stress to the resin at high temperature. The resin part is easily scratched, so avoid friction with hard materials. When installing the assembly board in equipment, ensure that this product does not come into contact with other components.
Mounting Methods
(1) Reflow soldering * * Package surface temperature: 260C (max) Please perform reflow soldering using the following reference temperature profile. Perform reflow soldering no more than twice.
Temperature (C) (R)
260C max 230C 190C 180C Preheat 60~120 s 30~50 s
Time (s) (R)
* *
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30C, 60% RH max Do not perform flow soldering. Make any necessary soldering corrections manually. (only once at each soldering point) Temperature: 350C or less Time: within 5 s
* *
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TPS819
(2) Recommended soldering pattern
1.6
1.3
1.6
Unit: mm
(3)
Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50C 30 s or : 30C 3 min Ultrasonic cleaning: 300 W or less
Packing Display
(1) Packing quantity
Reel (minimum packing quantity) Carton 3000 pcs 5 reels (15000 pcs)
(2)
Packing form To avoid moisture absorption by the resin, the devices are sealed in an aluminum package with silica gel. Buffer materials are enclosed with carton. * Carton appearance
0.95
0.6
0.95
Label position
Carton dimensions (W) 81 mm (L) 280 mm (H) 280 mm
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TPS819
Tape Packing Specifications
(1) Reel dimensions
11.4 1 9 0.3
+0 f180 - 4 f21 0.3 f13 0.5
2 0.5
Label
(2)
Tape dimensions
4.0 0.1 + 0.1 f1.5 0 2.0 0.05 A 1.75 0.1 0.2 0.05 max 6 max 6
f60 3.5 0.1 8.0 0.2
B
B'
4.0 0.1
(2.75)
3.6 0.1
Device Orientation A' Feed direction
1.3 0.1 A-A'
2.8 0.1
max 6
max 6
B-B'
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TPS819
P - Ta
80 70 10
ILEAK - Ta
Please refer to Figure 2
(typ.)
P (mW)
(mA)
60 50 40 30 20 10
1
Power dissipation
Dark current ILEAK
0.1
0.01 VCC = 3 V VCC = 5 V
0 0
20
40
60
80
100
0.001 20
40
60
80
100
Ambient temperature Ta (C)
Ambient temperature Ta (C)
IL - EV
10000 Ta = 25C Please refer to Figure 1 1000
(typ.)
1.4 VCC = 3 V
IL - Ta
Using the A light source Please refer to Figure 1 1.2
(typ.)
IL (mA)
Light current
100
Relative light current
1.0
10
A light source VCC = 3 V Fluorescent light VCC = 3 V A light source VCC = 5 V Fluorescent light VCC = 5 V
0.8 E = 10 lx (A light source) E = 100 lx (Fluorescent light) E = 100 lx (A light source) 0.6 -40 -20 0 20 40 60 80 100
1 1
10
100
1000
10000
100000
Illuminance EV
(lx)
Ambient temperature Ta (C)
IL - VCC
1.6 Ta = 25C Please refer to Figure 1 1.2
(typ.)
10 VCC = 3 V Ta = 25C Please refer to Figure 4
Vo - EV
(typ.)
(V)
1
Relative light current
0.8
Output voltage Vo
0.1
0.4
0.01
Fluorescent light 7.5 kW Fluorescent light 1 kW A light source 7.5 kW A light source 1 kW
0 2
3
4
5
6
7
0.001 1
10
100
1000
10000
100000
Supply voltage VCC
(V)
Illuminance EV
(lx)
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ICC - EV
10000 VCC = 3 V Ta = 25C Using the A light source 1000 RL = 1 kW Please refer to Figure 3
(typ.)
Consumption current
ICC
(mA)
100
10
1 1
10
100
1000
Illuminance EV
(lx)
Switching characteristics (Non-saturating operation)
10000 Ta = 25C VCC = 3 V VOUT = 1.5 V lp = 522 nm Please refer to Figure 5
(typ.)
10000 Ta = 25C
Switching characteristics (Saturating operation)
(typ.)
VCC = 3 V > VOUT = 2 V lp = 522 nm Please refer to Figure 5
1000
1000
tf
tf
(ms)
td
Switching time
Switching time
(ms)
100 tr
100
ts
td
10 ts 10
tr
1 0.1
1
10
1 0.1
1
10
Load resistance RL
(kW)
Load resistance RL
(kW)
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Spectral response
1.0 Ta = 25C 0.8
(typ.)
Radiation pattern
(typ.)
Ta = 25C Luminosity angle
20 30 40 10 0 10
Relative sensitivity
0.6
20 30 40 50 60 70 80 90 1.0
0.4 60 0.2 70 80 0 200 90
50
400
600
800
1000
1200
0
0.2
0.4
0.6
0.8
Wavelength l
(nm)
Relative sensitivity
Measurement Circuits
VCC Light TPS819 A IL OUT TPS819 A VCC ILEAK OUT
Figure 1 Light current measurement circuit
Figure 2 Dark current measurement circuit
Icc VCC A Light TPS819 RL VCC OUT Light TPS819 RL V Vo
Figure 3 Consumption current measurement circuit
Figure 4 Output voltage measurement circuit
Pulse drive lp = 522 nm LED
VCC
TPS819 RL
OUT
Figure 5 Switching measurement circuit
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TPS819
RESTRICTIONS ON PRODUCT USE
000707EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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